A University of Seoul student team won the grand prize at Simulation Challenge 2026, held at Yeoksam POSCO Tower in southern Seoul on July 30. The Simulation Challenge was an academic competition organized by Synopsys Korea’s Simulation & Analysis Division and co-hosted by Tae Sung S&E. Participating teams used simulation software to propose solutions to technical industry challenges and demonstrate the feasibility of their designs. The university said the Save the World with Hybrid Bonding team from its Advanced Packaging Lab earned the top prize in the undergraduate division of the competition. The team participated in the event under the guidance of Park Ah-young, a professor in the Department of Materials Science and Engineering. The team consisted of materials science and engineering majors Choi Seung-uk and Jang Sun-woong, and chemical engineering major Kim Kwon-hee. It presented its research titled “Design of a Radial Collet Bonding Tool for Reducing Voids in the Hybrid Bonding Process.” Hybrid bonding is a technology that directly bonds copper pads and dielectric layers. It i